Nanointerconnects
Nanoscale wiring and connections in chips
ASML
Veldhoven, Netherlands
World leader in photolithography equipment including EUV systems for sub-7nm chip manufacturing
Nano Dimension
Ness Ziona, Israel
Pioneer in additively manufactured electronics (AME), developing 3D printing systems for multi-layer PCBs and electronic components
WIN Semiconductors
Taoyuan, Taiwan
World's largest pure-play compound semiconductor foundry specializing in GaAs
GlobalFoundries
Malta, United States
Leading semiconductor foundry with advanced nanoscale manufacturing
UMC
Hsinchu, Taiwan
Major semiconductor foundry with nanoscale manufacturing capabilities
Tower Semiconductor
Migdal HaEmek, Israel
Specialty semiconductor foundry with analog and MEMS capabilities
Qorvo MEMS
Greensboro, United States
RF MEMS filters and switches for mobile and 5G applications
Avalanche Technology
Fremont, United States
Pioneer in perpendicular STT-MRAM technology
CelLink
San Carlos, United States
Flexible printed circuit technology for EV batteries
QphoX
Delft, Netherlands
Quantum networking and interconnects using nanophotonics
ASE Technology
Kaohsiung, Taiwan
World's largest semiconductor packaging and testing company
BESI
Duiven, Netherlands
Advanced semiconductor packaging equipment
STMicroelectronics
Geneva, Switzerland
Global semiconductor leader in MEMS, MCUs, and SiC
Mellanox Technologies
Yokneam, Israel
High-performance interconnect solutions, now part of NVIDIA
Broadcom
San Jose, United States
Major semiconductor company for networking and infrastructure
Marvell Technology
Wilmington, United States
Data infrastructure semiconductor company
Skyworks Solutions
Irvine, United States
RF semiconductor solutions for mobile and IoT
Lattice Semiconductor
Hillsboro, United States
Low power FPGAs for edge AI and embedded
MaxLinear
Carlsbad, United States
RF and mixed-signal semiconductors for broadband
Unisem
Ipoh, Malaysia
Semiconductor packaging and test services
Inari Amertron
Penang, Malaysia
RF and optoelectronic packaging services
Indium Corporation
Clinton, United States
Specialty alloys and thermal interface materials
Ajinomoto Build-up Film
Tokyo, Japan
Dominant supplier of ABF substrate materials
STATS ChipPAC
Singapore, Singapore
Advanced semiconductor packaging and test services
Hana Micron
Bac Ninh, Vietnam
Semiconductor packaging services in Vietnam
Microchip Technology
Chandler, United States
MCUs, analog, and FPGA solutions for embedded systems
Qorvo
Greensboro, United States
RF solutions including GaN for mobile, defense, and infrastructure
Murata Manufacturing
Nagaokakyo, Japan
MLCCs, sensors, and RF components using advanced ceramic technology
TDK Corporation
Tokyo, Japan
Electronic components including MLCCs, inductors, and sensors
Vishay Intertechnology
Malvern, United States
Discrete semiconductors and passive components for electronics
Kyocera AVX
Fountain Inn, United States
Advanced electronic components including capacitors and connectors
Samsung Electro-Mechanics
Suwon, South Korea
MLCCs, camera modules, and IC substrates for electronics
DuPont Electronics & Industrial
Wilmington, United States
Advanced materials including photoresists, CMP, and packaging materials
SK Materials
Yeongju, South Korea
Specialty gases and materials for semiconductor manufacturing
Shoei Chemical
Tokyo, Japan
Metal nanoparticle pastes and electronic materials
Heraeus Electronics
Hanau, Germany
Nano-silver sinter pastes and bonding materials for power electronics
Electroninks
Austin, United States
Reactive silver inks for printed electronics
Taiwan Semiconductor Research Institute
Hsinchu, Taiwan
Advanced semiconductor and nanoelectronics research
Vishay Intertechnology
Malvern, United States
Precision resistors and optical sensors
Samsung System LSI
Hwaseong, South Korea
Image sensors and mobile processors
Ayar Labs
San Jose, United States
In-package optical I/O for high-performance computing
Lightmatter
Boston, United States
Photonic computing for AI acceleration
SiFive
San Mateo, United States
Leading RISC-V processor IP provider
Ventana Micro Systems
Cupertino, United States
High-performance RISC-V for datacenter
Cerebras Systems
Sunnyvale, United States
Wafer-scale AI chips
Enflame Technology
Shanghai, China
Enflame Technology is a prominent Chinese AI chip company specializing in high-performance processors for AI training and inference workloads in cloud data centers and edge deployments. Founded in 2018 and based in Shanghai, Enflame has rapidly emerged as a major player in China's domestic AI semiconductor industry, developing competitive alternatives to dominant international AI accelerators. The company's flagship CloudBlazer series processors are designed for large-scale AI training in cloud environments, delivering hundreds of teraFLOPS of compute performance optimized for deep learning workloads including large language models, computer vision networks, and recommendation systems. CloudBlazer chips feature innovative architecture incorporating high-bandwidth memory, efficient interconnects for multi-chip scaling, and optimized tensor computation units that accelerate matrix operations fundamental to neural network training and inference. Enflame's DTU (Deep Learning Training Unit) products target enterprise AI infrastructure, providing cost-effective performance for organizations deploying AI at scale across various industries. The company has developed a comprehensive software ecosystem called TopsRider that supports major AI frameworks including TensorFlow, PyTorch, and PaddlePaddle, enabling seamless deployment of existing models with minimal code changes. Enflame emphasizes ease of migration and developer productivity through extensive optimization libraries, debugging tools, and performance profiling capabilities. The technology serves diverse applications including autonomous driving perception and planning, natural language processing and chatbots, recommendation engines for e-commerce and content platforms, intelligent video analytics, and scientific computing simulations. With over $500 million in funding from leading Chinese venture capital firms and strategic investors, Enflame has built a team of over 500 engineers and established partnerships with major cloud service providers, telecommunications companies, and internet giants throughout China. The company represents China's push toward AI semiconductor independence and technological self-reliance in critical computing infrastructure.
Montage Technology
Shanghai, China
Memory interface and server chips
Diodes Incorporated
Plano, United States
Discrete, analog, and mixed-signal semiconductors
Littelfuse
Chicago, United States
Circuit protection and power semiconductors
FTDI Chip
Glasgow, United Kingdom
USB connectivity and embedded solutions
Parade Technologies
Hsinchu, Taiwan
High-speed interface and display ICs
Quectel Wireless Solutions
Shanghai, China
Cellular and GNSS modules for IoT
Sierra Wireless
Vancouver, Canada
IoT cellular modules and gateways
Lattice Semiconductor
Portland, United States
Low power FPGAs for edge AI
Achronix Semiconductor
Santa Clara, United States
High-performance FPGAs and eFPGA IP
Efinix
Santa Clara, United States
Quantum programmable FPGAs
Gowin Semiconductor
Guangzhou, China
Programmable logic devices
Macom Technology
Lowell, United States
High-performance analog semiconductors
Akoustis Technologies
Huntersville, United States
Bulk acoustic wave RF filter solutions
Resonant Inc
Goleta, United States
RF filter design software (now Murata)
Kulicke & Soffa
Fort Washington, United States
Wire and die bonding equipment for semiconductor packaging
Amkor Technology
Tempe, United States
Leading OSAT for semiconductor packaging and test services
JCET Group
Wuxi, China
China's largest semiconductor packaging and test company
Powertech Technology
Hsinchu, Taiwan
Memory packaging specialist and OSAT provider
ChipMOS Technologies
Hsinchu, Taiwan
Semiconductor assembly and test for memory and drivers
Shinko Electric Industries
Nagano, Japan
IC substrates and semiconductor packaging materials
Ibiden
Ogaki, Japan
High-density IC substrates and packaging materials
Unimicron
Taoyuan, Taiwan
IC substrates and HDI PCBs for semiconductor packaging
Nan Ya PCB
New Taipei, Taiwan
ABF substrates and PCBs for semiconductor applications
Coventor (Lam Research)
Cary, United States
MEMS design and simulation software (Lam Research)
Luxtera (Cisco)
Carlsbad, United States
Silicon photonics pioneer with optical transceivers for data centers (acquired by Cisco)
POET Technologies
Toronto, Canada
Optical interposer platform integrating electronics and photonics for data center optics
Google TPU
Mountain View, United States
Custom tensor processing units designed for machine learning workloads
AWS Trainium
Seattle, United States
Amazon's custom AI chips for machine learning training and inference
Cerebras Systems
Sunnyvale, United States
Pioneer in wafer-scale AI chips with world's largest processor
SambaNova Systems
Palo Alto, United States
Dataflow architecture for AI with reconfigurable computing
d-Matrix
Santa Clara, United States
In-memory computing for AI inference with digital processing-in-memory
Rebellions
Seoul, South Korea
Korean AI chip startup developing neural processing units
Xilinx AI
San Jose, United States
Adaptive computing platform with AI engines in Versal chips
Blaize
El Dorado Hills, United States
Edge AI computing company with graph streaming processors for automotive and industrial applications
Ciena Corporation
Hanover, United States
Network systems and software company providing optical and packet networking solutions
Asus
Taipei, Taiwan
Taiwanese electronics company making laptops, motherboards, and gaming gear
Getaround
San Francisco, United States
Car sharing platform with instant access technology
NanoDimension
Ness Ziona, Israel
3D printed electronics with nano-inks
Applied Nanotech Holdings
Austin, United States
Nanotechnology solutions and IP licensing
NcodiN
Warsaw, Poland
Nano-optoelectronic devices
Chiral
Zurich, Switzerland
Robotic machines for automated wafer-scale integration of nanomaterials into electronics